Copyright©2009Cree,Inc.Allrightsreserved.Theinformationinthisdocumentissubjecttochangewithoutnotice.Creeandthe

Creelogoareregisteredtrademarks,andEZBright.EZ1000andEZaretrademarksofCree,Inc.

2

CPR3EC Rev. A

Cree,Inc.

4600SiliconDrive

Durham,NC27703

USATel:+1.919.313.5300

Fax:+1.919.313.5778

www.cree.com

Maximum Ratings at T

Note 1, 2 & 3

CxxxEZ1000-Sxx000-2

DCForwardCurrent

1000mA

PeakForwardCurrent(1/10dutycycle@1kHz)

1250mA

LEDJunctionTemperature

150°C

ReverseVoltage

5V

OperatingTemperatureRange

-40°Cto+100°C

StorageTemperatureRange

-40°Cto+125°C

Typical Electrical/Optical Characteristics at T

Note 2

Part Number

Forward Voltage (V

Reverse Current

[I(Vr=5V), μA]

Full Width Half Max

(

λ

Min.

Typ.

Max.

Max.

Typ.

C450EZ1000-Sxx000-2

2.9

3.2

3.8

2

20

C460EZ1000-Sxx000-2

2.9

3.2

3.8

2

21

C527EZ1000-Sxx000-2

3.0

3.4

4.0

2

35

Mechanical Specifications

CxxxEZ1000-Sxx000-2

Description

Dimensions

Tolerance

P-NJunctionArea(μm)

950x950

±35

ChipArea(μm)

980x980

±35

ChipThickness(μm)

170

±25

TopAuBondPad(μm)-Qty.2

150x150

±25

AuBondPadThickness(μm)

3.0

±1.5

BackContactMetalArea(μm)

980x980

±35

BackContactMetalThickness(μm)

3.0

±1.5

Notes:

1.

Maximumratingsarepackage-dependent.Theaboveratingsweredeterminedusinga3.45x3.45mmSMTpackagewithoutan

encapsulantforcharacterization.Ratingsforotherpackagesmaydiffer.Thejunctiontemperatureshouldbecharacterizedina

specificpackagetodeterminelimitations.Assemblyprocessingtemperaturemustnotexceed325°C(<5seconds).SeeCree

EZBrightApplicationsNoteforassembly-processinformation.

2.

Allproductsconformtothelistedminimumandmaximumspecificationsforelectricalandopticalcharacteristicswhenassembled

andoperatedat350mAwithinthemaximumratingsshownabove.Efficiencydecreasesathighercurrents.Typicalvaluesgiven

arewithintherangeofaveragevaluesexpectedbythemanufacturerinlargequantitiesandareprovidedforinformationonly.All

measurementsweremadeusingaAu-platedTO39headerwithoutanencapsulant.Opticalcharacteristicsweremeasuredinan

integratingsphereusingIlluminanceE.

3.

ThemaximumforwardcurrentisdeterminedbythethermalresistancebetweentheLEDjunctionandambient.Itiscrucialfor

theend-producttobedesignedinamannerthatminimizesthethermalresistancefromtheLEDjunctiontoambientinorderto

optimizeproductperformance.

0

200

400

600

800

1000

1200

25

50

75

100

125

150

175

Ambient Temperature (˚C)