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CM453232-560KL Datasheet(PDF) 2 Page - Bourns Electronic Solutions

Part # CM453232-560KL
Description  High resistance to heat and humidity
Download  7 Pages
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Manufacturer  BOURNS [Bourns Electronic Solutions]
Direct Link  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

CM453232-560KL Datasheet(HTML) 2 Page - Bourns Electronic Solutions

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Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
Packaging Specifications
Packaging
Reel Dimensions
Model
A
B
W
F
E
P1
P2
P3
¿D0
¿D1
t1
t2
CM10
0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
2.00 (.079)
4.00 (.157)
1.50 (.059) 0.60 (.024)
0.27 (.011)
1.20 (.047)
CM16
1.00 (.039) 1.80 (.071) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
2.00 (.079)
4.00 (.157)
1.50 (.059) 0.60 (.024)
0.27 (.011)
1.20 (.047)
CM20
1.45 (.057) 2.25 (.089) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
2.00 (.079)
4.00 (.157)
1.50 (.059) 1.00 (.039)
0.25 (.010)
1.55 (.061)
CM25
2.40 (.094) 2.90 (.114) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
2.00 (.079)
4.00 (.157)
1.50 (.059) 1.10 (.043)
0.25 (.010)
1.85 (.073)
CM32
2.80 (.110) 3.60 (.142) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
2.00 (.079)
4.00 (.157)
1.50 (.059)
0.25 (.010)
2.40 (.094)
CM45
3.60 (.142) 4.90 (.193) 12.00 (.472) 5.50 (.217) 1.75 (.069) 8.00 (.315)
2.00 (.079)
4.00 (.157)
1.50 (.059)
0.30 (.012)
3.50 (.138)
CM10, CM16, CM20, CM25, CM32
CM45
Model
A
B
C
D
E
W
CM10
178 (7.008)
60 min. 13 (.512)
21 (.827)
2 (.079)
9 (.354)
CM16
178 (7.008)
60 min. 13 (.512)
21 (.827)
2 (.079)
9 (.354)
CM20
178 (7.008)
60 min. 13 (.512)
21 (.827)
2 (.079)
9 (.354)
CM25
178 (7.008)
60 min. 13 (.512)
21 (.827)
2 (.079)
9 (.354)
CM32
178 (7.008)
60 min. 13 (.512)
21 (.827)
2 (.079)
9 (.354)
CM45
178 (7.008)
60 min. 13 (.512)
21 (.827)
2 (.079) 13 (.512)
Model
Quantity
Weight
CM10
10000 pcs
150 g
CM16
3000 pcs
90 g
CM20
3000 pcs
90 g
Model
Quantity
Weight
CM25
2000 pcs
100 g
CM32
2000 pcs
190 g
CM45
500 pcs
100 g
Soldering
Flow Soldering
Infrared Soldering
Vapor-phase Soldering
Flow Soldering
260 °C maximum for 5 seconds (2 wave solder method)
Infrared
200 °C for a maximum of 30 seconds. Peak of 240 °C for a maximum of 5 seconds.
If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the
board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.
Vapor-phase
215 °C for a maximum of 30 seconds.
10 seconds max.
260 °C
Preheat:
100 to 150 °C
2 minutes
min.
Preheat:
100 to 150 °C
2 minutes
min.
10 seconds max.
230 °C
200 °C
30 seconds max.
Preheat:
100 to 150 °C
2 minutes
min.
10 seconds max.
220 °C
215 °C
30 seconds max.
B
A
W
D
C
E
P1
P2
P3
A
D1
DIA.
B
ØDo
W
F
E
t2
t1
Tape running direction
Chip
Component
P1
P2
P3
A
B
ØDo
W
F
E
t2
t1
Chip
Component
Tape running direction


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