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AD7982 Datasheet(PDF) 23 Page - Analog Devices |
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AD7982 Datasheet(HTML) 23 Page - Analog Devices |
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23 / 24 page 
AD8475 Rev. B | Page 23 of 24 OUTLINE DIMENSIONS 3.10 3.00 SQ 2.90 0.30 0.25 0.20 1.65 1.50 SQ 1.45 1 0.50 BSC BOTTOM VIEW TOP VIEW 16 5 8 9 12 13 4 EXPOSED PAD PIN 1 INDICATOR 0.50 0.40 0.30 SEATING PLANE 0.05 MAX 0.02 NOM 0.20 REF 0.20 MIN COPLANARITY 0.08 PIN 1 INDICATOR 0.80 0.75 0.70 COMPLIANT TO JEDEC STANDARDS MO-229. FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 57. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 3 mm × 3 mm Body, Very Very Thin Quad (CP-16-27) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-187-BA 6° 0° 0.70 0.55 0.40 5 10 1 6 0.50 BSC 0.30 0.15 1.10 MAX 3.10 3.00 2.90 COPLANARITY 0.10 0.23 0.13 3.10 3.00 2.90 5.15 4.90 4.65 PIN 1 IDENTIFIER 15° MAX 0.95 0.85 0.75 0.15 0.05 Figure 58. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters |
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