 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
APX803-23SAG-7 Datasheet(PDF) 4 Page - Diodes Incorporated |
|
||||||||||||||||||||||||||||||
APX803-23SAG-7 Datasheet(HTML) 4 Page - Diodes Incorporated |
|
|
4 / 10 page 
APX803 3-PIN MICROPROCESSOR RESET CIRCUIT APX803 Rev. 1 4 of 10 MARCH 2010 Document number: DS32132 Rev. 1 – 2 www.diodes.com © Diodes Incorporated Electrical Characteristics (TA = 25ºC) TA= -40 to 85 °C unless otherwise note. Typical values are at T A=+25 °C. Symbol Parameter Test Conditions Min Typ. Max Unit ICC Supply Current VTH + 0.2V 30 40 μA VTH Reset Threshold APX803-23 TA = 25 oC 2.21 2.25 2.30 V APX803-26 2.59 2.63 2.66 APX803-29 2.89 2.93 2.96 APX803-31 3.04 3.08 3.13 APX803-40 3.94 4.00 4.06 APX803-44 4.31 4.38 4.45 APX803-46 4.56 4.63 4.70 Reset Threshold Tempco 30 ppm/ oC tS Set-up Time VCC = VTH to (VTH – 100mV) 20 µs tDELAY Reset Active Timeout Period TA = 0 oC to +85oC 140 200 280 ms VOL T RESE Output Voltage Low VCC = VTH -0.2, ISINK = 1.2mA 0.3 V VCC = VTH -0.2, ISINK = 3.5mA 0.4 VCC > 1.0V, ISINK = 50uA 0.3 IOH T RESE Output High leakage current VCC > VTH +0.2 1 µA θ JA Thermal Resistance Junction-to-Ambient SOT23/ SOT23R (Note 3) 201 °C/W θ JC Thermal Resistance Junction-to-Case SOT23/ SOT23R (Note 3) 56 °C/W Notes: 3. Test condition for SOT23 and SOT23R: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 4. Final datasheet limits to be determined by characterization and correlation. |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
