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AXK7L34223G Datasheet(PDF) 6 Page - Panasonic Semiconductor |
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AXK7L34223G Datasheet(HTML) 6 Page - Panasonic Semiconductor |
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6 / 8 page  Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ Notes on Using Narrow-pitch Connectors (Common) ACCTB48E 201204-T Regarding soldering 1. Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 2) As for cream solder printing, screen printing is recommended. 3) To determine the relationship between the screen opening area and the PC- board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. 4) Consult us when using a screen- printing thickness other than that recommended. 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) N2 reflow, conducting reflow soldering in a nitrogen atmosphere, increases the solder flow too greatly, enabling wicking to occur. Make sure that the solder feed rate and temperature profile are appropriate. Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). • Narrow-pitch connectors (except P8 type) • Narrow-pitch connector (P8) For products other than the ones above, please refer to the latest product specifications. 7) The temperatures are measured at the surface of the PC board near the connector terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 8) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector beforehand and then begin mounting. 9) Consult us when using a screen- printing thickness other than that recommended. 10) Some solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. 2. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) For soldering of prototype devices during product development, you can perform soldering at the necessary locations by heating with a hot-air gun by applying cream solder to the foot pattern beforehand. However, at this time, make sure that the air pressure does not move connectors by carefully holding them down with tweezers or other similar tool. Also, be careful not to go too close to the connectors and melt any of the molded components. 8) If an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3. Solder reworking 1) Finish reworking in one operation. 2) For reworking of the solder bridge, use a soldering iron with a flat tip. To prevent flux from climbing up to the contact surfaces, do not add more flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. Terminal Paste solder PC board foot pattern 60 to 120 sec. Preheating Peak temperature 200 °C 220 °C Upper limited (Solder heat resistance) Peak temperature 260 °C 230 °C 180 °C 150 °C 70 sec. 25 sec. Lower limited (Solder wettability) Time Temperature 60 to 120 sec. Preheating Time Temperature Peak temperature 200 °C 155 to 165 °C 245 °C max. Within 30 sec. Product name Soldering iron temperature SMD type connectors 300 °C within 5 sec. 350 °C within 3 sec. Apply the solder wire here Terminal Pattern PC board Small angle as possible up to 45 degrees |
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