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NCP361SNT1G Datasheet(PDF) 11 Page - ON Semiconductor |
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NCP361SNT1G Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 12 page NCP361, NCV361 http://onsemi.com 11 PACKAGE DIMENSIONS UDFN6 2x2, 0.65P CASE 517AB ISSUE B *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.47 0.40 0.65 1.70 2.30 1 DIMENSIONS: MILLIMETERS 6X 0.95 PITCH 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. C A SEATING PLANE D B E 0.10 C A3 A A1 2X 2X 0.10 C DIM A MIN MAX MILLIMETERS 0.45 0.55 A1 0.00 0.05 A3 0.127 REF b 0.25 0.35 D 2.00 BSC D2 1.50 1.70 0.80 1.00 E 2.00 BSC E2 e 0.65 BSC K 0.25 0.35 L PIN ONE REFERENCE 0.08 C 0.10 C 6X A 0.10 C L e E2 b B 3 6 6X 1 K 4 6X 6X 0.05 C 4X D2 BOTTOM VIEW 0.20 --- |
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