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AXK6F50547YG Datasheet(PDF) 3 Page - Panasonic Semiconductor |
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AXK6F50547YG Datasheet(HTML) 3 Page - Panasonic Semiconductor |
3 / 10 page Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXK(5/6)F ACCTB23E 201303-T SPECIFICATIONS 1. Characteristics 2. Material and surface treatment Item Specifications Conditions Electrical characteristics Rated current 0.5A/pin contact (Max. 10 A at total pin contacts) Rated voltage 60V AC/DC Breakdown voltage 150V AC for 1 minute Detection current: 1mA Insulation resistance Min. 1,000M Ω (initial) Using 500V DC megger Contact resistance Max. 90m Ω Based on the contact resistance measurement method specified by JIS C 5402. Mechanical characteristics Composite insertion force Max. 0.981N/pin contacts × pin contacts (initial) Composite removal force Min. 0.0588N/pin contacts × pin contacts Contact holding force Min. 0.981N/pin contact Measuring the maximum force. As the contact is axially pull out. Environmental characteristics Ambient temperature –55 °C to +85°C No freezing at low temperatures Soldering heat resistance Max. peak temperature of 260 °C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 °C within 5 seconds, 350°C within 3 seconds Soldering iron Storage temperature –55 °C to +85°C (product only) –40 °C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation. Thermal shock resistance (header and socket mated) 5 cycles, insulation resistance min. 100M Ω, contact resistance max. 90m Ω Conformed to MIL-STD-202F, method 107G Humidity resistance (header and socket mated) 120 hours, insulation resistance min. 100M Ω, contact resistance max. 90m Ω Bath temperature 40 ±2°C, humidity 90 to 95% R.H. Saltwater spray resistance (header and socket mated) 24 hours, insulation resistance min. 100M Ω, contact resistance max. 90m Ω Bath temperature 35 ±2°C, saltwarter concentration 5±1% H2S resistance (header and socket mated) 48 hours, contact resistance max. 90m Ω Bath temperature 40 ±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Lifetime characteristics Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours Unit weight Mated height 1.5mm, 20 pin contacts; Socket: 0.06g Header: 0.04g Part name Material Surface treatment Molded portion LCP resin (UL94V-0) — Contact/Post Copper alloy Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) The section close to the soldering portion has a nickel barrier. (The nickel base is exposed.) Order Temperature ( °C) Time (minutes) 1 2 3 4 –55 85 –55 0 −3 30 Max. 5 30 Max. 5 +3 0 0 −3 |
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