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AXK764147G Datasheet(PDF) 4 Page - Panasonic Semiconductor

Part # AXK764147G
Description  Narrow pitch connectors (0.4mm pitch) Construction makes designing devices easier.
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

AXK764147G Datasheet(HTML) 4 Page - Panasonic Semiconductor

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Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7, 8
ACCTB3E 201212-T
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Item
Specification
Conditions
Electrical
characteristics
Rated current
0.3A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
60V AC/DC
Breakdown voltage
150V AC for 1 min.
Detection current: 1mA
Insulation resistance
Min. 1,000MΩ (initial)
Using 250V DC megger (applied for 1 min.)
Contact resistance
Max. 70mΩ
Based on the contact resistance measurement method
specified y JIS C 5402.
Mechanical
characteristics
Composite insertion force
Max. 0.981N {100gf}/pin contacts × pin contacts (initial)
Composite removal force
Min. 0.0588N {6gf}/pin contacts × pin contacts
(Mated height 1.5 mm without soldering terminals type)
Min. 0.118N {12gf}/pin contacts × pin contacts
All the other types except the above
(Mated height 1.5 mm without soldering terminals type)
Post holding force
Min. 0.981N {100gf}/pin contacts
Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient temperature
–55°C to +85°C
No freezing at low temperatures
Soldering heat resistance
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
Infrared refl w soldering
300°C within 5 sec. 350°C within 3 sec.
Soldering iron
Storage temperature
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No freezing at low temperatures.
No dew condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
Bath temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 70mΩ
Bath temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life
50 times
Repeated insertion and removal speed of max. 200
times/hours
Unit weight
Mated height 1.5mm, 20 pin contacts;
Socket: 0.04g Header: 0.02g
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
Contact and Post
Copper alloy
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
However, upper terminal of Ni barrier production: Exposed over Ni
The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.
Soldering terminals portion
Copper alloy
Ni plating on base, Sn plating on surface (Except for front terminal)
Order Temperature (°C)
Time (minutes)
1
2
3
4
–55
85
–55
0
−3
30
Max. 5
30
Max. 5
+3
0
0
−3


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