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AYF311115 Datasheet(PDF) 5 Page - Panasonic Semiconductor
PANASONIC [Panasonic Semiconductor]
AYF311115 Datasheet(HTML) 5 Page - Panasonic Semiconductor
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Automation Controls Business Unit
Notes on Using FPC Connectors
PC board design
Design the recommended foot pattern in
order to secure the mechanical strength
in the soldered areas of the terminal.
FPC and equipment design
Design the FPC based with
recommended dimensions to ensure the
required connector performance.
When back lock type is used, secure
enough space for closing the lever and
for open-close operation of the lever.
Due to the FPC size, weight, or the
reaction force of the routed FPC.
Carefully check the equipment design
and take required measures to prevent
the FPC from being removed due to a fall,
vibration, or other impact.
Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
1) Manual soldering.
• Due to the connector’s compact size, if
an excessive amount of solder is applied
during manual soldering, the solder may
creep up near the contact points, or
solder interference may cause imperfect
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the speciﬁcations.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any ﬂux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reﬂow soldering
• Screen-printing is recommended for
printing paste solder.
• To achieve the appropriate soldering
state, make sure that the reﬂow
temperature, PC board foot pattern,
window size and thickness of metal mask
are recommended condition.
• Note that excess solder on the terminals
prevents complete insertion of the FPC,
and that excess solder on the soldering
terminals prevents the lever from rotating.
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reﬂow temperature
proﬁle is given in the ﬁgure below
Recommended reﬂow temperature
• The temperature is measured on the
surface of the PC board near the
• Certain solder and ﬂux types may cause
serious solder creeping. Solder and ﬂux
characteristics should be taken into
consideration when setting the reﬂow
• When performing reﬂow soldering on
the back of the PC board after reﬂow
soldering the connector, secure the
connector using, for example, an
adhesive. (Double reﬂow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a ﬂat tip. Do not add
ﬂux, otherwise the ﬂux may creep to the
• Use a soldering iron whose tip
temperature is within the temperature
range speciﬁed in the speciﬁcations.
Do not drop or handle the
connector carelessly. Otherwise, the
terminals may become deformed due
to excessive force or applied
solderability may be during reﬂow
Don’t open/close the lever or insert/
remove an FPC until the connector is
soldered. Forcibly applied external
pressure on the terminals can weaken
the adherence of the terminals to the
molded part or cause the terminals to
lose their evenness. In addition, do
not insert an FPC into the connector
before soldering the connector.
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive force.
When coating the PC board after
soldering the connector (to prevent the
deterioration of insulation), perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
PC board foot pattern
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
60 to 120 sec.
Please refer to the latest product
speciﬁcations when designing your
The soldered areas should not be subjected to force.
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