C03E.pdf

May.17,2013

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

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6. Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when

inspecting the electrical performance of a capacitor after

mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the

pressure of a test pin, etc.

The thrusting force of the test probe can flex the PCB,

resulting in cracked chips or open solder joints.

Provide support pins on the back side of the PCB to

prevent warping or flexing.

1-2. Avoid vibration of the board by shock when a test pin

contacts a printed circuit board.

7. Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do

not apply any stress to the capacitor that is caused by

bending or twisting the board.

1-1. In cropping the board, the stress as shown at right

may cause the capacitor to crack.

Avoid this type of stress to a capacitor.

Continued from the preceding page.

Continued on the following page.

[Not Recommended]

[Recommended]

Peeling

Test-pin

Support Pin

Test-pin

[Bending]

[Twisting]

5. Washing

Excessive ultrasonic oscillation during cleaning can cause

the PCBs to resonate, resulting in cracked chips or broken

solder joints. Take note not to vibrate PCBs.

4-4. Leaded Component Insertion

1. If the PCB is flexed when leaded components (such as

transformers and ICs) are being mounted, chips may

crack and solder joints may break.

Before mounting leaded components, support the PCB

using backup pins or special jigs to prevent warping.

!Caution