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GCM21BR72A473KA37 Datasheet(PDF) 54 Page - Murata Manufacturing Co., Ltd. |
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GCM21BR72A473KA37 Datasheet(HTML) 54 Page - Murata Manufacturing Co., Ltd. |
54 / 67 page C03E.pdf May.17,2013 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 52 5. Optimum Solder Amount for Flow Soldering 5-1. The top of the solder fillet should be lower than the thickness of the components. If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition. Table 2 [Standard Conditions for Flow Soldering] [Allowable Flow Soldering Temperature and Time] In the case of repeated soldering, the accumulated soldering time must be within the range shown above. Soldering Time (sec.) 260 270 280 250 240 230 220 010 20 30 40 Up to Chip Thickness Adhesive Continued from the preceding page. Continued on the following page. Recommended Conditions Soldering Peak Temperature Atmosphere Pb-Sn Solder 240 to 250°C Air Lead Free Solder 250 to 260°C Preheating Peak Temperature 90 to 110°C 100 to 120°C N2 30-90 seconds 5 seconds max. ΔT Gradual Cooling Soldering Preheating Preheating Peak Temperature Time Temperature ( D) Soldering Peak Temperature Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu 4-2. Flow Soldering 1. Do not apply flow soldering to chips not listed in table 2. 2. When sudden heat is applied to the components, the mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both of the components and the PCB board. Preheating conditions are shown in table 2. It is required to keep the temperature differential between the solder and the components surface ( ΔT) as low as possible. 3. Excessively long soldering time or high soldering temperature can result in leaching of the outer electrodes, causing poor adhesion or a reduction in capacitance value due to loss of contact between the electrodes and end termination. 4. When components are immersed in solvent after mounting, be sure to maintain the temperature differential ( ΔT) between the component and solvent within the range shown in the table 2. in section GC3/GCD/GCM Series 18/21/31 sizes (Except for characteristics of X8L, X8G) GCJ Series Rated Voltage 250VDC or more 18/21/31 sizes ΔTV150°C Part Number Temperature Differential !Caution |
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