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GCM21BR72A473KA37 Datasheet(PDF) 54 Page - Murata Manufacturing Co., Ltd.

Part # GCM21BR72A473KA37
Description  Chip Monolithic Ceramic Capacitors for Automotive
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Manufacturer  MURATA [Murata Manufacturing Co., Ltd.]
Direct Link  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

GCM21BR72A473KA37 Datasheet(HTML) 54 Page - Murata Manufacturing Co., Ltd.

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C03E.pdf
May.17,2013
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
52
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Table 2
[Standard Conditions for Flow Soldering]
[Allowable Flow Soldering Temperature and Time]
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Soldering Time (sec.)
260
270
280
250
240
230
220
010
20
30
40
Up to Chip Thickness
Adhesive
Continued from the preceding page.
Continued on the following page.
Recommended Conditions
Soldering Peak Temperature
Atmosphere
Pb-Sn Solder
240 to 250°C
Air
Lead Free Solder
250 to 260°C
Preheating Peak Temperature
90 to 110°C
100 to 120°C
N2
30-90 seconds
5 seconds max.
ΔT
Gradual
Cooling
Soldering
Preheating
Preheating
Peak
Temperature
Time
Temperature (
D)
Soldering
Peak
Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4-2. Flow Soldering
1. Do not apply flow soldering to chips not listed in table 2.
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB board.
Preheating conditions are shown in table 2. It is required
to keep the temperature differential between the solder
and the components surface (
ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between the electrodes and
end termination.
4. When components are immersed in solvent after
mounting, be sure to maintain the temperature differential
(
ΔT) between the component and solvent within the range
shown in the table 2.
in section
GC3/GCD/GCM Series 18/21/31 sizes
(Except for characteristics of X8L, X8G)
GCJ Series Rated Voltage 250VDC
or more 18/21/31 sizes
ΔTV150°C
Part Number
Temperature Differential
!Caution


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