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RT9198-34PB Datasheet(PDF) 10 Page - Richtek Technology Corporation

Part # RT9198-34PB
Description  Low-Noise for RF Application, Fast Response in Line/Load Transient
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9198-34PB Datasheet(HTML) 10 Page - Richtek Technology Corporation

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RT9198/A
10
DS9198/A-14 April 2011
www.richtek.com
For recommended operating conditions specification of
RT9198/A, where TJ(MAX) is the maximum junction
temperature of the die (125
°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance (
θJA is layout dependent) for TSOT-23-3/TSOT-
23-5/SOT-23-3/SOT-23-5 package is 250
°C/W, SC-70-5
and SC-82 package is 333
°C/W and WDFN-6L 2x2
package is 165
°C/W on standard JEDEC 51-3 thermal
test board. The maximum power dissipation at TA = 25
°C
can be calculated by following formula :
PD(MAX) = (125
°C − 25°C)/250 = 400mW (TSOT-23-3/
TSOT-23-5/SOT-23-3/SOT-23-5)
PD(MAX) = (125
°C − 25°C)/333 = 300mW (SC-70-5/SC-82)
PD(MAX) = (125
°C − 25°C) / 165 = 606mW (WDFN-6L 2x2)
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance
θJA. For RT9198/A packages, the Figure 2. of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Figure 2. Derating Curve for Packages
0
100
200
300
400
500
600
700
0
153045607590
105 120 135
Ambient Temperature (°C)
SOT-23-3/SOT-23-5
TSOT-23-3/TSOT-23-5
SC 70-5
SC-82
WDFN-6L 2x2


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