A244

DF23 Series

BUsage Precautions

1.Recommended

Temperature Profile

Temperature

Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a return

to normal temperature between the first and second cycle.

Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the

connector terminals.

2.Recommended Manual

Soldering Conditions

4.Board Warping

■When manually handling the connectors avoid touching any portion of exposed terminal leads.

5.Cleaning Conditions

6.Use and handling precautions.

3.Recommended Screen

Thickness and Open Area

Ratio (Pattern Area Ratio)

Temperature: 290

ç±10ç, Soldering time: within 2 sec.

50

60sec max

Soldering

100

150

200

250

Time (sec.)

Temperature (ç)

0

100

150

200

250

50

Room temperature

300

90~120sec

Preheating

180ç

250ç

220ç

150ç

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.