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FH26W-31S-0.3SHW Datasheet(PDF) 5 Page - Hirose Electric

Part # FH26W-31S-0.3SHW
Description  0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors
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Manufacturer  HIROSE [Hirose Electric]
Direct Link  http://www.hirose-connectors.com
Logo HIROSE - Hirose Electric

FH26W-31S-0.3SHW Datasheet(HTML) 5 Page - Hirose Electric

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5
FH26 Series
G0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors
IRecommended FPC Construction
1. Using Single-sided FPC
Material Name
Covering film layer.
Cover adhesive
Surface treatment
Copper foil
Base adhesive
Base film
Reinforcement material adhesive
Stiffener
Polyimide
1 mil thick.
1µm to 5µm Nickel underplated
0.2µm Gold plated
Cu
1/2oz
Thermosetting adhesive
Polyimide
1 mil thick
Thermosetting adhesive
Polyimide
3 mil thick
Total
25
25
3
35
25
25
40
75
203
Material
Thickness (µm)
2. Using Double-sided FPC
Material Name
Back side
Covering layer film
Cover adhesive
Surface treatment
Through-hole copper
Copper foil
Base adhesive
Base film
Base adhesive
Copper foil
Cover adhesive
Covering layer film
Reinforcement material adhesive
Stiffener
Polyimide
1 mil thick
1µm to 5µm Nickel underplated
0.2µm Gold plated
Cu
Cu
1/2oz
Thermosetting adhesive
Polyimide
1 mil thick
Thermosetting adhesive
Cu
1/2oz
Thermosetting adhesive
Polyimide
1 mil thick
Thermosetting adhesive
Polyimide
1 mil thick
Total
25
25
3
15
18
18
25
18
18
25
25
25
25
197
Material
Thickness (µm)
GTo prevent release of the FPC due to it's bending, use of double sided FPC with copper foil on the back side is NOT RECOMMENDED.
GContact FPC manufacturer for specific details.
Back side
Connecting side
Connecting side
1. This specification is a recommendation for the construction of the FH26 Series FPC and FFC (t=0.2 ± 0.03).
2. For details about the construction, please contact the FPC/FFC manufacturers.
3. Precautions
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.


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