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FH26W-21S-0.3SHW Datasheet(PDF) 5 Page - Hirose Electric |
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FH26W-21S-0.3SHW Datasheet(HTML) 5 Page - Hirose Electric |
5 / 12 page 5 FH26 Series G0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors IRecommended FPC Construction 1. Using Single-sided FPC Material Name Covering film layer. Cover adhesive Surface treatment Copper foil Base adhesive Base film Reinforcement material adhesive Stiffener Polyimide 1 mil thick. 1µm to 5µm Nickel underplated 0.2µm Gold plated Cu 1/2oz Thermosetting adhesive Polyimide 1 mil thick Thermosetting adhesive Polyimide 3 mil thick Total 25 25 3 35 25 25 40 75 203 Material Thickness (µm) 2. Using Double-sided FPC Material Name Back side Covering layer film Cover adhesive Surface treatment Through-hole copper Copper foil Base adhesive Base film Base adhesive Copper foil Cover adhesive Covering layer film Reinforcement material adhesive Stiffener Polyimide 1 mil thick 1µm to 5µm Nickel underplated 0.2µm Gold plated Cu Cu 1/2oz Thermosetting adhesive Polyimide 1 mil thick Thermosetting adhesive Cu 1/2oz Thermosetting adhesive Polyimide 1 mil thick Thermosetting adhesive Polyimide 1 mil thick Total 25 25 3 15 18 18 25 18 18 25 25 25 25 197 Material Thickness (µm) GTo prevent release of the FPC due to it's bending, use of double sided FPC with copper foil on the back side is NOT RECOMMENDED. GContact FPC manufacturer for specific details. Back side Connecting side Connecting side 1. This specification is a recommendation for the construction of the FH26 Series FPC and FFC (t=0.2 ± 0.03). 2. For details about the construction, please contact the FPC/FFC manufacturers. 3. Precautions The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. |
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