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IXTQ26P20P Datasheet(PDF) 1 Page - IXYS Corporation |
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IXTQ26P20P Datasheet(HTML) 1 Page - IXYS Corporation |
1 / 6 page © 2007 IXYS CORPORATION, All rights reserved Symbol Test Conditions Maximum Ratings V DSS T J = 25 °C to 175°C - 200 V V DGR T J = 25 °C to 175°C, R GS = 1MΩ - 200 V V GSS Continuous ±20 V V GSM Transient ±30 V I D25 T C = 25°C - 26 A I DM T C = 25°C, pulse width limited by TJM - 70 A I AR T C = 25°C - 26 A E AR T C = 25°C50 mJ E AS T C = 25°C 1.5 J dV/dt I S ≤ I DM, VDD ≤ VDSS, TJ ≤ 175°C 10 V/ns P D T C = 25°C 300 W T J -55 ... +175 °C T JM 175 °C T stg -55 ... +175 °C T L 1.6mm (0.062 in.) from case for 10s 300 °C T SOLD Plastic body for 10s 260 °C M d Mounting torque (TO-3P,TO-220,TO-247) 1.13/10 Nm/lb.in. Weight TO-247 6.0 g TO-3P 5.5 g TO-220 3.0 g TO-263 2.5 g DS99913(10/07) Symbol Test Conditions Characteristic Values (T J = 25°C, unless otherwise specified) Min. Typ. Max. BV DSS V GS = 0V, ID = -250 μA - 200 V V GS(th) V DS = VGS, ID = -250μA - 2.5 - 4.5 V I GSS V GS = ±20V, VDS = 0V ±100 nA I DSS V DS = VDSS - 10 μA V GS = 0V T J = 150°C - 250 μA R DS(on) V GS = -10V, ID = 0.5 • ID25, Note 1 170 m Ω PolarPTM Power MOSFET P-Channel Enhancement Mode Avalanche Rated IXTA26P20P IXTH26P20P IXTP26P20P IXTQ26P20P V DSS = - 200V I D25 = - 26A R DS(on) ≤ ≤≤≤≤ 170m Ω Ω Ω Ω Ω Preliminary Technical Information Features: International standard packages Fast intrinsic diode Dynamic dV/dt Rated Avalanche Rated Rugged PolarPTM process Low Q G and Rds(on) characterization Low Drain-to-Tab capacitance Low package inductance - easy to drive and to protect Applications: Hight side switching Push-pull amplifiers DC Choppers Current regulators Automatic test equipment Advantages: Low gate charge results in simple drive requirement Improved Gate, Avalanche and dynamic dV/dt ruggedness High power density Fast switching G = Gate D = Drain S = Source TAB = Drain TO-263 (I XTA) G S D(TAB) TO-247 (IXTH) TO-220 (I XTP) D D(TAB) G S G D S TO-3P (IXTQ) D(TAB) G D S D(TAB) |
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