Revision: November 15, 2011, 16:49

©2011 Littelfuse, Inc.

Specifications are subject to change without notice.

Transient Voltage Suppression Diodes

4

Surface Mount – 5000W > 5.0SMDJ series

5.0SMDJ Series

Please refer to http://www.Littelfuse.com/series/5.0SSMDJ.html for current information.

Physical Specifications

Weight

0.007 ounce, 0.21 grams

Case

JEDEC DO214AB. Molded plastic body

over glass passivated junction

Polarity

Color band denotes positive end

(cathode) except Bidirectional.

Terminal

Matte Tin-plated leads, Solderable per

JESD22-B102D

Dimensions

Dimensions

Inches

Millimeters

Min

Max

Min

Max

A

0.114

0.126

2.900

3.200

B

0.260

0.280

6.600

7.110

C

0.220

0.245

5.590

6.220

D

0.079

0.103

2.060

2.620

E

0.030

0.060

0.760

1.520

F

-

0.008

-

0.203

G

0.305

0.320

7.750

8.130

H

0.006

0.012

0.152

0.305

I

0.129

-

3.300

-

J

0.094

-

2.400

-

K

-

0.165

-

4.200

L

0.094

-

2.400

-

Environmental Specifications

Temperature Cycle

JESD22-A104

Pressure Cooker

JESD 22-A102

High Temp. Storage

JESD22-A103

HTRB

JESD22-A108

Thermal Shock

JESD22-A106

Soldering Parameters

Time (t)

Preheat

Ramp-up

Critical Zone

Ramp-down

t 25˚C to Peak

25˚C

Reflow Condition

Lead–free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (LiquidusTemp

(T

3°C/second max

T

3°C/second max

Reflow

-Temperature (T

217°C

-Time (min to max) (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

280°C

DO-214AB (SMC J-Bend)

Dimensions in inches and (millimeters)

Cathode Band

B

F

G

H

E

C

D

A

(all dimensions in mm)

I

L

K

J

Solder Pads