PACKAGE OPTION ADDENDUM

www.ti.com

13-Nov-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

PTH04T240WAD

ACTIVE

Through-

Hole Module

EAY

11

49

Pb-Free (RoHS)

SN

N / A for Pkg Type

Request Free Samples

PTH04T240WAS

ACTIVE

Surface

Mount Module

EAZ

11

49

TBD

SNPB

Level-1-235C-UNLIM/

Level-3-260C-168HRS

Request Free Samples

PTH04T240WAST

ACTIVE

Surface

Mount Module

EAZ

11

250

TBD

SNPB

Level-1-235C-UNLIM/

Level-3-260C-168HRS

Purchase Samples

PTH04T240WAZ

ACTIVE

Surface

Mount Module

BAZ

11

49

Pb-Free (RoHS)

SNAGCU

Level-3-260C-168 HR

Request Free Samples

PTH04T240WAZT

ACTIVE

Surface

Mount Module

BAZ

11

250

Pb-Free (RoHS)

SNAGCU

Level-3-260C-168 HR

Purchase Samples

PTH04T241WAD

ACTIVE

Through-

Hole Module

EAY

11

49

Pb-Free (RoHS)

SN

N / A for Pkg Type

Request Free Samples

PTH04T241WAS

ACTIVE

Surface

Mount Module

EAZ

11

49

TBD

SNPB

Level-1-235C-UNLIM/

Level-3-260C-168HRS

Request Free Samples

PTH04T241WAST

ACTIVE

Surface

Mount Module

EAZ

11

250

TBD

SNPB

Level-1-235C-UNLIM/

Level-3-260C-168HRS

Purchase Samples

PTH04T241WAZ

ACTIVE

Surface

Mount Module

BAZ

11

49

Pb-Free (RoHS)

SNAGCU

Level-3-260C-168 HR

Request Free Samples

PTH04T241WAZT

ACTIVE

Surface

Mount Module

BAZ

11

250

Pb-Free (RoHS)

SNAGCU

Level-3-260C-168 HR

Purchase Samples

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.