CY7C1370D-250AXC datasheet(11/31 Pages) CYPRESS

Part #	CY7C1370D-250AXC

Description	18-Mbit (512 K 횞 36/1 M 횞 18) Pipelined SRAM with NoBL??Architecture

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Manufacturer	CYPRESS [Cypress Semiconductor]

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CY7C1370D, CY7C1372D

Document Number: 38-05555 Rev. *N

Page 11 of 31

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1370D incorporates a serial boundary scan test

access port (TAP). This part is fully compliant with 1149.1. The

TAP operates using JEDEC-standard 3.3 V or 2.5 V I/O logic

levels.

The CY7C1370D contains a TAP controller, instruction register,

boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG

feature. To disable the TAP controller, TCK must be tied LOW

(VSS) to prevent clocking of the device. TDI and TMS are

internally pulled up and may be unconnected. They may

alternately be connected to VDD through a pull-up resistor. TDO

should be left unconnected. Upon power-up, the device will

come up in a reset state which will not interfere with the operation

of the device.

The 0/1 next to each state represents the value of TMS at the

rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are

captured on the rising edge of TCK. All outputs are driven from

the falling edge of TCK.

Test Mode Select (TMS)

The TMS input is used to give commands to the TAP controller

and is sampled on the rising edge of TCK. It is allowable to leave

this ball unconnected if the TAP is not used. The ball is pulled up

internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball is used to serially input information into the registers

and can be connected to the input of any of the registers. The

register between TDI and TDO is chosen by the instruction that

is loaded into the TAP instruction register. TDI is internally pulled

up and can be unconnected if the TAP is unused in an

application. TDI is connected to the most significant bit (MSB) of

any register.

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the

registers. The output is active depending upon the current state

of the TAP state machine. The output changes on the falling edge

of TCK. TDO is connected to the least significant bit (LSB) of any

register.

Performing a TAP Reset

A Reset is performed by forcing TMS HIGH (VDD) for five rising

edges of TCK. This Reset does not affect the operation of the

SRAM and may be performed while the SRAM is operating.

At power-up, the TAP is reset internally to ensure that TDO

comes up in a High Z state.

TAP Registers

Registers are connected between the TDI and TDO balls and

allow data to be scanned into and out of the SRAM test circuitry.

Only one register can be selected at a time through the

instruction register. Data is serially loaded into the TDI ball on the

rising edge of TCK. Data is output on the TDO ball on the falling

edge of TCK.

Instruction Register

Three-bit instructions can be serially loaded into the instruction

register. This register is loaded when it is placed between the TDI

and TDO balls as shown in the TAP Controller Block Diagram on

page 14. Upon power-up, the instruction register is loaded with

the IDCODE instruction. It is also loaded with the IDCODE

instruction if the controller is placed in a reset state as described

in the previous section.

When the TAP controller is in the Capture-IR state, the two least

significant bits are loaded with a binary “01” pattern to allow for

fault isolation of the board-level serial test data path.

Bypass Register

To save time when serially shifting data through registers, it is

sometimes advantageous to skip certain chips. The bypass

register is a single-bit register that can be placed between the

TDI and TDO balls. This allows data to be shifted through the

SRAM with minimal delay. The bypass register is set LOW (VSS)

when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all the input and

bidirectional balls on the SRAM.

The boundary scan register is loaded with the contents of the

RAM I/O ring when the TAP controller is in the Capture-DR state

and is then placed between the TDI and TDO balls when the

controller is moved to the Shift-DR state. The EXTEST,

SAMPLE/PRELOAD and SAMPLE Z instructions can be used to

capture the contents of the I/O ring.

The Boundary Scan Order tables show the order in which the bits

are connected. Each bit corresponds to one of the bumps on the

SRAM package. The MSB of the register is connected to TDI and

the LSB is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor-specific, 32-bit code

during the Capture-DR state when the IDCODE command is

loaded in the instruction register. The IDCODE is hardwired into

the SRAM and can be shifted out when the TAP controller is in

the Shift-DR state. The ID register has a vendor code and other

information described in the Identification Register Definitions

table.

TAP Instruction Set

Overview

Eight different instructions are possible with the three bit

instruction register. All combinations are listed in the Instruction

Codes table. Three of these instructions are listed as

RESERVED and should not be used. The other five instructions

are described in detail below.

Instructions are loaded into the TAP controller during the Shift-IR

state when the instruction register is placed between TDI and

TDO. During this state, instructions are shifted through the

instruction register through the TDI and TDO balls. To execute

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CY7C1370D-250AXC Datasheet(PDF) 11 Page - Cypress Semiconductor

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