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D2TO035CR0100GKE3 Datasheet(PDF) 1 Page - Vishay Siliconix |
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D2TO035CR0100GKE3 Datasheet(HTML) 1 Page - Vishay Siliconix |
1 / 6 page D2TO35 www.vishay.com Vishay Sfernice Revision: 22-Apr-13 1 Document Number: 51058 For technical questions, contact: sfer@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Surface Mount Power Resistor Thick Film Technology FEATURES • AEC-Q200 qualified • 35 W at 25 °C case temperature • Surface mounted resistor - TO-263 (D2PAK) style package • Wide resistance range from 0.01 to 550 k • Non inductive • Resistor isolated from metal tab • Solder reflow secure at 270 °C/10 s • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Notes • For the asssembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C • Power dissipation is 3.3 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 standard, 70 μm of copper, 39 mm x 30 mm x 1.6 mm DIMENSIONS in millimeters STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE RESISTANCE RANGE RATED POWER P25 °C W LIMITING ELEMENT VOLTAGE UL V TOLERANCE ± % TEMPERATURE COEFFICIENT ± ppm/°C CRITICAL RESISTANCE D2TO35 TO-263 0.01 to 550K 35 500 1, 2, 5, 10 150, 250, 700, 1100 7.14K 10.5 1.6 8.8 1.6 Tolerance: ± 0.3 mm 11.00 1.50 6.50 4.02 4.00 2.40 8.00 2.49 0.26 Footprint recommendation for solderable contact area: 1.25 4.5 2.8 2.2 0.3 2 5.08 7.6 7.8 min. 8.7 0.2 10.1 MECHANICAL SPECIFICATIONS Mechanical Protection Molded Resistive Element Thick film Substrate Alumina Connections Tinned copper Weight 2.2 g max. ENVIRONMENTAL SPECIFICATIONS Temperature Range - 55 °C to 175 °C Flammability IEC 60695-11-5 2 applications 30 s separated by 60 s TECHNICAL SPECIFICATIONS Power Rating and Thermal Resistance of the Component 35 W at 25 °C (case temperature) RTH (j - c): 4.28 °C/W Temperature Coefficient See Special Feature table Standard ± 150 ppm/°C Dielectric Strength IEC 60115-1 2000 VRMS - 1 min - 10 mA max. (between terminals and board) Insulation Resistance 106 M Inductance 0.1 μH DIMENSIONS Standard Package TO-263 style (D2PAK) |
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