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RC2012J000CS Datasheet(PDF) 13 Page - Samsung semiconductor

Part No. RC2012J000CS
Description  Thick Film Chip Resistor ( General )
Download  19 Pages
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Maker  SAMSUNG [Samsung semiconductor]
Homepage  http://www.samsung.com/Products/Semiconductor
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RC2012J000CS Datasheet(HTML) 13 Page - Samsung semiconductor

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TAPING METHOD
There are empty holes at both start part and end part of carrier tape. <Fig 5>
<Fig 5>
Reel
Packed Part
Empty Part
Lead Part
Adhesion Tape
***
**
****
Empty Portion
Chips
Empty Portion
Lead Part
10 Pitches
or more
5,000 Pitches
or
20,000 Pitches
10 Pitches
or more
200~250 mm
Note
The resistor should move in the pocket freely.
The resistor should not adhere to the top or bottom tape.
There should be no vacant pocket.
Peeling strength of the top tape should be within 5gf and 80gf. <Fig 6>
<Fig 6>
0~10°
Top Tape
Chip Resistor
Carrier Tape
Bottom Tape
F
Peeling


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