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RC2012J000CS Datasheet(PDF) 10 Page - Samsung semiconductor |
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RC2012J000CS Datasheet(HTML) 10 Page - Samsung semiconductor |
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10 / 19 page 
▷ Bending Test Board ▶ Sketch of Withstanding voltage and Insulation resistance ▶ Test board ▷ Test board <Table 14>, <Fig 11> are dimensions of test board. * Board material : epoxy JIS C 6484 * pattern material : pure copper 99.5% or above JIS C 6484 <Table 15>, <Fig 12> are dimensions of bending test board. * Board material : epoxy JIS C 6484 * pattern material : pure copper 99.5% or above JIS C 6484 P2 P1 P1 V Substrate Cu Cu Cu <Fig 13> <Fig 11> item Dimension (mm) Dimension Power a b c f 0603 1/20W 0.3 1.1 0.45 5.2 1005 1/16W 0.6 1.9 0.7 4.9 1608 1/10W 1.0 3.0 1.2 4.5 2012 1/8W 1.2 4.0 1.65 4.3 3216 1/4W 2.2 5.0 2.0 3.3 3225 1/3W 2.2 5.0 2.9 3.3 5025 2/3W 3.6 7.0 3.0 3.0 6432 1W 5.2 8.0 3.5 2.5 <Table 14> 58.5 Connector 3 5.08 b c 10 - φ1.0 7.5 5.5 a f 3.5 3 25 : COPPER PATTERN : SOLDER - RESISTOR <Fig 12> b af d=4. 5 40 c 100 <Table 15> item Dimensio n (mm) Dimension Power a b c f 0603 1/20W 0.3 1.1 0.45 5.2 1005 1/16W 0.6 1.9 0.7 4.9 1608 1/10W 1.0 3.0 1.2 4.5 2012 1/8W 1.2 4.0 1.65 4.3 3216 1/4W 2.2 5.0 2.0 3.3 3225 1/3W 2.2 5.0 2.9 3.3 5025 2/3W 3.6 7.0 3.0 3.0 6432 1W 5.2 8.0 3.5 2.5 : COPPER PATTERN : SOLDER - RESISTOR |
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