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CL10B101KB8NNNC Datasheet(PDF) 30 Page - Samsung semiconductor

Part # CL10B101KB8NNNC
Description  Multilayer Ceramic Capacitor
Download  35 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

CL10B101KB8NNNC Datasheet(HTML) 30 Page - Samsung semiconductor

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Multilayer Ceramic Capacitor - General
- 29 -
● Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.
▶ Soldering Methods
Method
Classification
Reflow
soldering
- Overall heating
- Infrared rays
- Hot plate
- VPS(vapor phase)
- Local heating
- Air heater
-Laser
- Light beam
Flow
soldering
- Single wave
- Double wave
-
* We recommend the reflow soldering method.
▶ Soldering Profile
To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.
300
250
200
150
100
50
preheating
soldering
cooling
60~120sec
10~20sec
Reflow Soldering
300
250
200
150
100
50
preheating
soldering
cooling
T≤150℃
60~120sec
3~4sec
Flow Soldering
▶ Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.


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