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74HC259D Datasheet(PDF) 14 Page - NXP Semiconductors |
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74HC259D Datasheet(HTML) 14 Page - NXP Semiconductors |
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14 / 23 page 
74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 14 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 12. Package outline Fig 13. Package outline SOT38-4 (DIP16) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT38-4 95-01-14 03-02-13 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w M E e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.03 0.17 0.02 0.13 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 |
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