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SM30T26AY Datasheet(PDF) 5 Page - STMicroelectronics |
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SM30T26AY Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 13 page SM30TY Characteristics Doc ID 022065 Rev 2 5/13 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead Figure 9. Peak forward voltage drop versus peak forward current (typical values) Figure 10. Relative variation of thermal impedance, junction to ambient, versus pulse duration I (A) FM 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 T = 150 °C j T = 25 °C j V (V) FM Z/R th(j-a) th(j-a) 0.01 0.10 1.00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Recommended pad layout Single pulse t (s) p epoxy printed board, FR4 copper thickness = 35 µm 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S (cm ) Cu 2 epoxy printed board, FR4 copper thickness = 35 µm |
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