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1-102974-0 Datasheet(PDF) 43 Page - Tyco Electronics

Part # 1-102974-0
Description  AMPMODU Interconnection System
Download  321 Pages
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Manufacturer  MACOM [Tyco Electronics]
Direct Link  http://www.macom.com
Logo MACOM - Tyco Electronics

1-102974-0 Datasheet(HTML) 43 Page - Tyco Electronics

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43
1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
Germany: 49-6251-133-1999
CIS WR 08/2011
millimeters unless otherwise
reference purposes only.
Canada: 1-905-475-6222
China: 86-400-820-6015
specified. Values in brackets
Specifications subject
Mexico: 52-55-1106-0800
Japan: 81-44-844-8013
te.com
are metric equivalents.
to change.
L. & S. America: 54-11-4733-2200
UK: 44-800-267-666
AMPMODU Interconnection System
3
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
Product Facts
I
Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
I
Double row, vertical,
shrouded header and
receptacle assemblies
I
Available in select sizes
from 10 through 100
positions
I
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
I
Compatible with standard
surface-mount processes
I
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
I
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
I
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.


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