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1-102974-0 Datasheet(PDF) 18 Page - Tyco Electronics |
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1-102974-0 Datasheet(HTML) 18 Page - Tyco Electronics |
18 / 321 page 18 1307819 Dimensions are in inches and Dimensions are shown for USA: 1-800-522-6752 Germany: 49-6251-133-1999 CIS WR 08/2011 millimeters unless otherwise reference purposes only. Canada: 1-905-475-6222 China: 86-400-820-6015 specified. Values in brackets Specifications subject Mexico: 52-55-1106-0800 Japan: 81-44-844-8013 te.com are metric equivalents. to change. L. & S. America: 54-11-4733-2200 UK: 44-800-267-666 AMPMODU Interconnection System 2 Board-to-Board Right-Angle Headers AMPMODU 50/50 Grid Right-Angle Headers will accommodate a variety of high density packaging applications; right-angle board-to-board applications when mated with vertical receptacles (page 15) and right-angle cable-to-board applications when mated with cable connectors (page 21). The small .050 x .050 [1.27 x 1.27] centerline contact spacing allows efficient use of the PC board area. Mechanical support of the headers to the PC board is provided by non-protrusive metallic holddowns designed for .062 [1.57] or thicker PC boards. These holddowns are of the same design as those used in the vertical headers (page 16) and receptacles (page 15). There are also metallic tabs that are soldered to the sur- faces of the PC board pads for added support. AMPMODU 50/50 Grid Right-Angle Headers are available in double-row, in either latching or non- latching versions, and in sizes ranging from 10 through 100 positions (in 10 position increments). The latching version provides positive retention when mated with the latching cable connector (page 21). All headers feature polariza- tion to help prevent mis- alignment during mating. Product Facts I Surface-mount products for right-angle board-to-board and cable-to-board applications I Double-row, right-angle shrouded headers I High density .050 x .050 [1.27 x 1.27] centerline grid I Latching and non-latching versions available I Non-protrusive metallic holddowns I Metallic tabs, when soldered to PC board pad, provide added mechanical support I Duplex plated post contacts; gold plated on mating area, tin plated on tails I Compatible with standard surface-mount processing (VPR and IR) I Standoffs on header housings allow for drainage of processing fluids I All headers are polarized I Sizes of 10, 20, 30, 40, 50, 60, 70, 80 and 100 positions I Recognized under the Component Program of Underwriters Laboratories Inc., File No. E28476 I Certified by Canadian Standards Association File No. LR7189 R R |
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