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RHFAC00K02V Datasheet(PDF) 11 Page - STMicroelectronics |
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RHFAC00K02V Datasheet(HTML) 11 Page - STMicroelectronics |
11 / 29 page DocID17352 Rev 4 11/29 54ACxxxx, 54ACTxxxx Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 2. Ceramic Flat-14 package outline Note: The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package. Connecting unused pins or metal lid to ground or to the power supply will not affect the electrical characteristics. 016029E 1 7 8 14 F G D H A B M N H C L E Table 6. Ceramic Flat-14 package mechanical data Symbol Dimensions (mm) Dimensions (inches) Min. Typ. Max. Min. Typ. Max. A 6.75 6.91 7.06 0.266 0.272 0.278 B 9.76 9.95 10.14 0.384 0.392 0.399 C 1.49 1.95 0.059 0.077 D 0.10 0.127 0.15 0.004 0.005 0.006 E 7.50 7.62 7.75 0.295 0.300 0.305 F 1.27 0.050 G 0.38 0.43 0.48 0.015 0.017 0.019 H 6.0 0.236 L 18.75 22.0 0.738 0.866 M 0.38 0.015 N 4.31 0.170 |
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