3

Outline Drawings

16 Pin DIP Through Hole, 2 Channels

Functional Diagrams

16 Pin DIP

8 Pin DIP

8 Pin DIP

16 Pin Flat Pack

20 Pad LCCC

Through Hole

Through Hole

Through Hole

Unformed Leads

Surface Mount

2 Channels

1 Channel

2 Channels

4 Channels

2 Channels

Note: All DIP and flat pack devices have common V

CC

and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic chip carrier)

package has isolated channels with separate V

CC

and ground connections. All diagrams are “top view.”

Leaded Device Marking

Leadless Device Marking

0.20 (0.008)

0.33 (0.013)

;

;;

;

;;

;

;;

;

;;

4.45 (0.175)

MAX.

20.06 (0.790)

20.83 (0.820)

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MIN.

0.89 (0.035)

1.65 (0.065)

8.13 (0.320)

MAX.

7.36 (0.290)

7.87 (0.310)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

3.81 (0.150)

MIN.

19

20

2

3

8

7

15

13

12

5

7

6

8

12

10

11

9

GND

1

3

2

4

16

14

15

13

GND

1

2

3

4

5

7

6

8

12

10

11

9

GND

1

3

2

4

16

14

15

13

1

3

2

4

8

6

7

5

GND

8

7

6

5

Notes

1. Qualified parts only

DATE CODE, SUFFIX (IF NEEDED)

A QYYWWZ

XXXXXX

XXXXXXX

XXX XXX

* 50434

COUNTRY OF MFR.

Avago LOGO

PIN ONE/

ESD IDENT

Avago P/N

* QUALIFIED PARTS ONLY

DATE CODE, SUFFIX (IF NEEDED)

A QYYWWZ

XXXXXX

* XXXX

XXXXXX

XXX 50434

Avago LOGO

COUNTRY OF MFR.

Avago P/N

PIN ONE/

ESD IDENT

* QUALIFIED PARTS ONLY