TPS5401

SLVSAB0 – DECEMBER 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

–40°C to 150°C

10-pin MSOP

TPS5401DGQ

(1)

For the most-current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

The DGQ package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS5401DGQR).

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating temperature range (unless otherwise noted).

VALUE

UNIT

MIN

MAX

VIN

–0.3

47

EN

–0.3

5

BOOT

55

VSENSE

–0.3

3

Input voltage

V

COMP

–0.3

3

PWRGD

–0.3

6

SS/TR

–0.3

3

RT/CLK

–0.3

3.6

BOOT – PH

8

Output voltage

PH

–0.6

47

V

PH, 10-ns transient

–2

47

Voltage difference

Thermal pad to GND

±200

mV

EN

100

mA

BOOT

100

mA

Source current

VSENSE

10

mA

PH

Current limit

A

RT/CLK

100

mA

VIN

Current limit

A

COMP

100

mA

Sink current

PWRGD

10

mA

SS/TR

200

mA

Electrostatic discharge (HBM) QSS 009-105 (JESD22-A114A)

1

kV

Electrostatic discharge (CDM) QSS 009-147 (JESD22-C101B.01)

500

V

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS5401

UNIT

MSOP (10 PINS)

Junction-to-ambient thermal resistance

68

°C/W

Junction-to-case(top) thermal resistance

63.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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