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TPS5401DGQ Datasheet(PDF) 2 Page - Texas Instruments |
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TPS5401DGQ Datasheet(HTML) 2 Page - Texas Instruments |
2 / 41 page TPS5401 SLVSAB0 – DECEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Table 1. ORDERING INFORMATION(1) TJ PACKAGE PART NUMBER(2) –40°C to 150°C 10-pin MSOP TPS5401DGQ (1) For the most-current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) The DGQ package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS5401DGQR). ABSOLUTE MAXIMUM RATINGS (1) Over operating temperature range (unless otherwise noted). VALUE UNIT MIN MAX VIN –0.3 47 EN –0.3 5 BOOT 55 VSENSE –0.3 3 Input voltage V COMP –0.3 3 PWRGD –0.3 6 SS/TR –0.3 3 RT/CLK –0.3 3.6 BOOT – PH 8 Output voltage PH –0.6 47 V PH, 10-ns transient –2 47 Voltage difference Thermal pad to GND ±200 mV EN 100 mA BOOT 100 mA Source current VSENSE 10 mA PH Current limit A RT/CLK 100 mA VIN Current limit A COMP 100 mA Sink current PWRGD 10 mA SS/TR 200 mA Electrostatic discharge (HBM) QSS 009-105 (JESD22-A114A) 1 kV Electrostatic discharge (CDM) QSS 009-147 (JESD22-C101B.01) 500 V Operating junction temperature –40 150 °C Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPS5401 THERMAL METRIC(1) UNIT MSOP (10 PINS) qJA Junction-to-ambient thermal resistance 68 °C/W qJC(top) Junction-to-case(top) thermal resistance 63.3 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS5401 |
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