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MT46V32M16P-5BJ Datasheet(PDF) 1 Page - Micron Technology

Part No. MT46V32M16P-5BJ
Description  Double Data Rate (DDR) SDRAM MT46V128M4 32 Meg x 4 x 4 banks MT46V64M8 16 Meg x 8 x 4 banks MT46V32M16 8 Meg x 16 x 4 banks
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Maker  MICRON [Micron Technology]
Homepage  http://www.micron.com
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MT46V32M16P-5BJ Datasheet(HTML) 1 Page - Micron Technology

 
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512Mb: x4, x8, x16 DDR SDRAM
Features
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb_DDR_x4x8x16_D1.fm - 512Mb DDR: Rev. O; Core DDR Rev. D 2/11 EN
1
©2000 Micron Technology, Inc. All rights reserved.
Double Data Rate (DDR) SDRAM
MT46V128M4 – 32 Meg x 4 x 4 banks
MT46V64M8 – 16 Meg x 8 x 4 banks
MT46V32M16 – 8 Meg x 16 x 4 banks
Features
•VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V
VDD = +2.6V ±0.1V, VDDQ = +2.6V ±0.1V (DDR400)1
• Bidirectional data strobe (DQS) transmitted/
received with data, i.e., source-synchronous data
capture (x16 has two – one per byte)
• Internal, pipelined double-data-rate (DDR)
architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• DLL to align DQ and DQS transitions with CK
• Four internal banks for concurrent operation
• Data mask (DM) for masking write data
(x16 has two – one per byte)
• Programmable burst lengths: 2, 4, or 8
•Auto refresh
– 64ms, 8192-cycle
• Longer-lead TSOP for improved reliability (OCPL)
• 2.5V I/O (SSTL_2 compatible)
• Concurrent auto precharge option is supported
tRAS lockout supported (tRAP = tRCD)
Notes: 1. DDR400 devices operating at < DDR333
conditions can use VDD/VDDQ = +2.5V +0.2V.
2. Available only on Revision F.
3. Available only on Revision J.
Options
Marking
• Configuration
– 128 Meg x 4 (32 Meg x 4 x 4 banks)
128M4
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
64M8
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
32M16
• Plastic package
– 66-pin TSOP
TG
– 66-pin TSOP (Pb-free)
P
– 60-ball FBGA (10mm x 12.5mm)
FN2
– 60-ball FBGA (10mm x 12.5mm) (Pb-free)
BN2
– 60-ball FBGA (8mm x 12.5mm)
CV3
– 60-ball FBGA (8mm x 12.5mm) (Pb-free)
CY3
• Timing – cycle time
– 5ns @ CL = 3 (DDR400)
-5B
– 6ns @ CL = 2.5 (DDR333) (FBGA only)
-62
– 6ns @ CL = 2.5 (DDR333) (TSOP only)
-6T2
• Self refresh
– Standard
None
– Low-power self refresh
L
• Temperature rating
– Commercial (0°C to +70°C)
None
– Industrial (–40°C to +85°C)
IT
• Revision
– x4, x8, x16
:F
– x4, x8, x16
:J
Table 1:
Key Timing Parameters
CL = CAS (READ) latency; data-out window is MIN clock rate with 50% duty cycle at CL = 2, CL = 2.5, or CL = 3
Speed
Grade
Clock Rate (MHz)
Data-Out
Window
Access
Window
DQS–DQ
Skew
CL = 2
CL = 2.5
CL = 3
-5B
133
167
200
1.6ns
±0.70ns
+0.40ns
-6
133
167
n/a
2.1ns
±0.70ns
+0.40ns
6T
133
167
n/a
2.0ns
±0.70ns
+0.45ns
-75E/-75Z
133
133
n/a
2.5ns
±0.75ns
+0.50ns
-75
100
133
n/a
2.5ns
±0.75ns
+0.50ns


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