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MT46V32M16P-5BJ Datasheet(PDF) 80 Page - Micron Technology

Part # MT46V32M16P-5BJ
Description  Double Data Rate (DDR) SDRAM MT46V128M4 ??32 Meg x 4 x 4 banks MT46V64M8 ??16 Meg x 8 x 4 banks MT46V32M16 ??8 Meg x 16 x 4 banks
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Manufacturer  MICRON [Micron Technology]
Direct Link  http://www.micron.com
Logo MICRON - Micron Technology

MT46V32M16P-5BJ Datasheet(HTML) 80 Page - Micron Technology

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Micron Technology, Inc., reserves the right to change products or specifications without notice.
DDR_x4x8x16_Core2.fm - 512Mb DDR: Rev. O; Core DDR Rev. D 2/11 EN
80
©2000 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR SDRAM
Operations
Figure 44:
WRITE-to-READ – Interrupting
Notes:
1. DI b = data-in for column b; DO n = data-out for column n.
2. An interrupted burst of 4 is shown; two data elements are written.
3. One subsequent element of data-in is applied in the programmed order following DI b.
4. tWTR is referenced from the first positive CK edge after the last data-in pair.
5. A10 is LOW with the WRITE command (auto precharge is disabled).
6. DQS is required at T2 and T2n (nominal case) to register DM.
7. If the burst of 8 is used, DM and DQS are required at T3 and T3n because the READ com-
mand will not mask these two data elements.
tDQSS (NOM)
CK
CK#
Command
WRITE
NOP
NOP
NOP
NOP
NOP
Address
Bank a,
Col b
Bank a,
Col n
READ
T0
T1
T2
T3
T2n
T4
T5
T5n
T1n
T6
T6n
tWTR
CL = 2
DQ
DQS
DM
DI
b
DO
n
tDQSS (MIN)
CL = 2
DQ
DQS
DM
DI
b
tDQSS (MAX)
CL = 2
DQ
DQS
DM
DI
b
DO
n
DO
n
Don’t Care
Transitioning Data
tDQSS
tDQSS
tDQSS
T3n


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