ISL71090SEH25

10

FN8451.0

June 6, 2013

Package Outline Drawing

K8.A

8 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

Rev 3, 3/13

LEAD FINISH

SIDE VIEW

TOP VIEW

-D-

-C-

0.265 (6.75)

0.110 (2.79)

0.026 (0.66)

0.265 (6.73)

SEATING AND

0.180 (4.57)

0.03 (0.76) MIN

BASE PLANE

-H-

0.009 (0.23)

0.005 (0.13)

PIN NO. 1

ID AREA

0.050 (1.27 BSC)

0.022 (0.56)

0.015 (0.38)

MIN

0.245 (6.22)

0.087 (2.21)

0.170 (4.32)

0.370 (9.40)

0.325 (8.26)

0.004 (0.10)

0.245 (6.22)

1.

adjacent to pin one and shall be located within the shaded area shown.

The manufacturer’s identification shall not be used as a pin one

identification mark. Alternately, a tab may be used to identify pin one.

2.

of the tab dimension do not apply.

3. The maximum limits of lead dimensions (section A-A) shall be

measured at the centroid of the finished lead surfaces, when solder

dip or tin plate lead finish is applied.

4.

5.

shall be molded to the bottom of the package to cover the leads.

6.

meniscus) of the lead from the body. Dimension minimum shall

be reduced by 0.0015 inch (0.038mm) maximum when solder dip

lead finish is applied.

7.

8.

NOTES:

0.015 (0.38)

0.008 (0.20)

PIN NO. 1

ID OPTIONAL

1

2

4

6

3

Dimensioning and tolerancing per ANSI Y14.5M - 1982.

Controlling dimension: INCH.

Index area: A notch or a pin one identification mark shall be located

If a pin one identification mark is used in addition to a tab, the limits

Measure dimension at all four corners.

For bottom-brazed lead packages, no organic or polymeric materials

Dimension shall be measured at the point of exit (beyond the

SECTION A-A

BASE

METAL

0.007 (0.18)

0.004 (0.10)

0.009 (0.23)

0.004 (0.10)

0.019 (0.48)

0.015 (0.38)

0.0015 (0.04)

MAX

0.022 (0.56)

0.015 (0.38)

0.036 (0.92)