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TPA2036D1 Datasheet(PDF) 15 Page - Texas Instruments |
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TPA2036D1 Datasheet(HTML) 15 Page - Texas Instruments |
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15 / 24 page 
_ + IN- IN+ PWM H- Bridge VO+ VO- Internal Oscillator CS To Battery VDD GND Bias Circuitry RI2 RP Filter-Free Class D SHUTDOWN RI1 Single-Ended Input 2 CI2 CP Single-Ended Input 1 CI1 BOARD LAYOUT Copper Trace Width Solder Mask Thickness Solder Pad Width Solder Mask Opening Copper Trace Thickness TPA2036D1 www.ti.com.............................................................................................................................................................................................. SLOS589 – OCTOBER 2008 Figure 32. Application Schematic With TPA2036D1 Summing Two Single-Ended Inputs In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 33 and Table 2 show the appropriate diameters for a WCSP layout. The TPA2036D1 evaluation module (EVM) layout is shown in the next section as a layout example. Figure 33. Land Pattern Dimensions Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Link(s): TPA2036D1 |
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