PMEG4050ETP

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 10 October 2011

3 of 13

NXP Semiconductors

PMEG4050ETP

40 V, 5 A low VF MEGA Schottky barrier rectifier

5.

Limiting values

[1]

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3]

Reflow soldering is the only recommended soldering method.

[4]

6.

Thermal characteristics

[1]

significant part of the total power losses.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3]

Reflow soldering is the only recommended soldering method.

[4]

[5]

[6]

Soldering point of cathode tab.

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

reverse voltage

-

40

V

average forward current

square wave;

δ = 0.5; f = 20 kHz;

[1]

-5

A

square wave;

δ = 0.5; f = 20 kHz;

-5

A

non-repetitive peak forward

current

-

70

A

total power dissipation

[2][3]

-

750

mW

[4][3]

-

1250

mW

[1][3]

-

2500

mW

junction temperature

-

175

°C

ambient temperature

-55

175

°C

storage temperature

-65

175

°C

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance

from junction to

ambient

in free air

[1][2][3]

-

-

200

K/W

[1][4][3]

-

-

120

K/W

[1][5][3]

--60

K/W

thermal resistance

from junction to solder

point

[6]

--12

K/W