Electronic Components Datasheet Search |
|
LP38853 Datasheet(PDF) 5 Page - Texas Instruments |
|
|
LP38853 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 28 page LP38853 www.ti.com SNVS335D – DECEMBER 2006 – REVISED APRIL 2013 Electrical Characteristics (continued) Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Symbol Parameter Conditions Min Typ Max Units AC Parameters VIN = VOUT(NOM) + 1V, - 80 - f = 120 Hz PSRR Ripple Rejection for VIN Input (VIN) Voltage VIN = VOUT(NOM) + 1V, - 70 - f = 1 kHz dB VBIAS = VOUT(NOM) + 3V, - 58 - f = 120 Hz PSRR Ripple Rejection for VBIAS Voltage (VBIAS) VBIAS = VOUT(NOM) + 3V, - 58 - f = 1 kHz Output Noise Density f = 120 Hz - 1 - µV/ √Hz en BW = 10 Hz − 100 kHz - 150 - Output Noise Voltage µVRMS BW = 300 Hz − 300 kHz - 90 - Thermal Parameters Thermal Shutdown Junction TSD - 160 - Temperature °C TSD(HYS) Thermal Shutdown Hysteresis - 10 - PFM - 60 - Thermal Resistance, Junction to θJ-A DDPAK-7 - 60 - Ambient(5) SO PowerPAD-8 - 168 - °C/W PFM-7 - 3 - Thermal Resistance, Junction to θJ-C DDPAK-7 - 3 - Case(5) (6) SO PowerPAD-8 - 11 - (5) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to ambient thermal resistance ( θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not exceed the maximum operating rating. See the Application Information section for details. (6) For PFM and DDPAK: θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-8: θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'. Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LP38853 |
Similar Part No. - LP38853 |
|
Similar Description - LP38853 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |