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LM75BIMM-3 Datasheet(PDF) 3 Page - Texas Instruments |
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LM75BIMM-3 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 23 page +VS A0 A1 A2 SCL SDA O.S. GND 8 7 6 5 3 1 2 4 LM75 Address (Set as desired) To Processor Interrupt Line Interface 100 nF (typ) unless mounted close to processor O.S. set to active low IRU ZLUH 25¶G PXOWLSOH interrupt line LM75B, LM75C www.ti.com SNIS153B – JULY 2009 – REVISED MARCH 2013 Typical Application Figure 2. Typical Application These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage Pin (+VS) −0.3V to 6.5V Voltage at A0, A1and A2 Pins −0.3V to (+VS + 0.3V) and must be ≤ 6.5V Voltage at OS, SCL and SDA Pins −0.3V to 6.5V Input Current at any Pin(2) 5 mA Package Input Current(2) 20 mA Storage Temperature −65°C to +150°C LM75B 2500V Human Body Model LM75C 1500V ESD Susceptibility(3) LM75B 250V Machine Model LM75C 100V O.S. Output Sink Current 10 mA O.S. Output Voltage 6.5V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. (2) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > +VS) the current at that pin should be limited to 5 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. (3) Human body model, 100 pF discharged through a 1.5 k Ω resistor. Machine model, 200 pF discharged directly into each pin. The Charged Device Model (CDM) is a specified circuit characterizing an ESD event that occurs when a device acquires charge through some triboelectric (frictional) or electrostatic induction processes and then abruptly touches a grounded object or surface. Operating Ratings (1) (2) Specified Temperature Range TMIN to TMAX See(3) −55°C to +125°C Supply Voltage Range (+VS) LM75B, LM75C +3.0V to +5.5V (1) Soldering process must comply with Texas Instruments Incorporated Reflow Temperature Profile specifications. Refer to (2) Reflow temperature profiles are different for lead-free and non-lead-free packages. (3) LM75 θJA (thermal resistance, junction-to-ambient) when attached to a printed circuit board with 2 oz. foil similar to the one shown in Figure 5 is summarized in the table below: Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM75B LM75C |
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