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BR93H86RFVM-2C Datasheet(PDF) 22 Page - Rohm

Part No. BR93H86RFVM-2C
Description  Serial EEPROM Series Automotive EEPROM 125℃ Operation Microwire BUS EEPROM (3-wire)
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Maker  ROHM [Rohm]
Homepage  http://www.rohm.com
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BR93H86RFVM-2C Datasheet(HTML) 22 Page - Rohm

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BR93H86-2C
22/29
Datasheet
Datasheet
www.rohm.com
19.DEC.2012 Rev.002
TSZ02201-0R1R0G100050-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Operational Notes
(1) Described numeric values and data are design representative values, and the values are not guaranteed.
(2) Application Circuit
Although we can recommend the application circuits contained herein with a relatively high degree of confidence, we
ask that you verify all characteristics and specifications of the circuit as well as its performance under actual conditions.
Please note that we cannot be held responsible for problems that may arise due to patent infringements or
noncompliance with any and all applicable laws and regulations.
(3) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
(4) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
(5) Thermal Consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc
≥Pd).
Package Power Dissipation
: Pd (W)=(Tjmax-Ta)/θja
Power Dissipation
: Pc (W)=(Vcc-Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
(6)
Short Between Pins and Mounting Errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
(7) Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.


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