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NTCG104LH154J Datasheet(PDF) 3 Page - TDK Electronics |
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NTCG104LH154J Datasheet(HTML) 3 Page - TDK Electronics |
3 / 14 page (2/13) 010-01 / 20090528 / eb221_ntcg.fm • All specifications are subject to change without notice. SHAPES AND DIMENSIONS Dimensions in mm RECOMMENDED PC BOARD PATTERN Dimensions in mm STRUCTURAL DIAGRAM RECOMMENDED REFLOW SOLDERING CONDITIONS Type L W T B 0603 0.6±0.03 0.3±0.03 0.3±0.03 0.1 min. 1005 1±0.05 0.5±0.05 0.5±0.05 0.1 min. 1608 1.6±0.1 0.8±0.1 0.8±0.1 0.2 min. 2012 2±0.2 1.25±0.2 0.7±0.2 0.2 min. Type a b c 0603 0.25 to 0.35 0.2 to 0.3 0.25 to 0.35 1005 0.3 to 0.5 0.35 to 0.45 0.4 to 0.6 1608 0.6 to 0.8 0.6 to 0.8 0.6 to 0.8 2012 0.9 to 1.2 0.7 to 0.9 0.9 to 1.2 L Electrode material Internal:Pd External:Ag/Ni/Sn B a b b Thermistor body (Metal oxide sintering ceramics) Inner electrode (Palladium) Sn plating Ni plating Ag termination underlayer Natural cooling 10s max. Preheating 60 to 120s Soldering 60s max. 220˚C 250˚C 260˚C max. 180˚C 150˚C Time(s) |
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