Datasheet

13/13

BU42xx series

BU43xx series

TSZ02201-0R7R0G300050-1-2

© 2013 ROHM Co., Ltd. All rights reserved.

22.May.2013 Rev.006

www.rohm.com

TSZ22111

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15

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001

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Operational Notes

1)

Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2)

Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

3)

Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

4)

Bypass Capacitor for Noise Rejection

Be careful when using extremely big capacitor as transient response will be affected.

5)

Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6)

Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7)

8)

9)

condition.

10) External parameters

that can affect characteristics. Please verify and confirm using practical applications.

11) Power on reset operation

operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to

the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special

consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.

15) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might

cause unexpected operations. Application values in these conditions should be selected carefully. If 10M

Ω leakage is

terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the

pull up resistor should be less than 1/10 of the assumed leak resistance. The value of Rct depends on the external