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BD15KA5WF-E2 Datasheet(PDF) 9 Page - Rohm |
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BD15KA5WF-E2 Datasheet(HTML) 9 Page - Rohm |
9 / 18 page Datasheet 9/15 BDxxKA5 Series BDxxKA5W Series BD00KA5W Series TSZ02201-0R6R0A600150-1-2 © 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111・15・001 26.Jun.2012 Rev.001 ●I/O equivalence circuit ●Power Dissipation When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22. The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX. Even when the ambient temperature Ta is a normal temperature (25℃), the chip(junction) temperature Tj may be quite high, so please operate the IC at temperatures less than the acceptable loss Pd. ※ With BD00KA5WFP/WF,R1and R2 are connected outside the IC between ADJ and GND and between OUT and ADJ. CTL Vcc Vcc Vcc OUT ADJ R1 R2 31.25kΩ 2kΩ 25kΩ (BD00KA5WFP/WF) Fig.18 Fig.19 Vcc Fig.20 Power Dissipation heat reducing characteristics TO252-5 0.0 0.4 0.8 1.2 1.6 2.0 0 25 50 75 100 125 150 Ambient temperature:Ta(℃) 1.30 Rohm standard board mounting Board size:70×70×1.6mm Copper foil area:7×7mm 2 θja=96.2(℃/W) TO252-3 Fig.21 Power Dissipation heat reducing characteristics 0.0 0.4 0.8 1.2 1.6 2.0 0 25 50 75 100 125 150 周囲温度:Ta(℃) 1.20 Rohm standard board mounting Board size:70×70×1.6mm Copper foil area:7×7mm 2 θja=104.2(℃/W) Ambient temperature:Ta(℃) SOP8 Fig.22 Power Dissipation heat reducing characteristics 0 200 400 600 800 1000 0 25 50 75 100 125 150 周囲温度:Ta(℃) 687.6mW 562.6mW (1) (2) (1)When using a standard board: θj-c=181.8(℃/W) (2) When using an IC alone θj-a=222.2(℃/W) Ambient temperature:Ta(℃) |
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