 2001-2012 Microchip Technology Inc.

DS21688D-page 9

TC670

5.3

Package Dimensions (6-Pin SOT-23)

10

5

0

10

5

0

Mold Draft Angle Bottom

10

5

0

10

5

0

Mold Draft Angle Top

0.50

0.43

0.35

.020

.017

.014

B

Lead Width

0.20

0.15

0.09

.008

.006

.004

c

Lead Thickness

10

5

0

10

5

0

Foot Angle

0.55

0.45

0.35

.022

.018

.014

L

Foot Length

3.10

2.95

2.80

.122

.116

.110

D

Overall Length

1.75

1.63

1.50

.069

.064

.059

E1

Molded Package Width

3.00

2.80

2.60

.118

.110

.102

E

Overall Width

0.15

0.08

0.00

.006

.003

.000

A1

Standoff

1.30

1.10

0.90

.051

.043

.035

A2

Molded Package Thickness

1.45

1.18

0.90

.057

.046

.035

A

Overall Height

1.90

.075

p1

Outside lead pitch (basic)

0.95

.038

p

Pitch

6

6

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

1

D

B

n

E

E1

L

c

A2

A

A1

p1

exceed .005" (0.127mm) per side.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

Notes:

JEITA (formerly EIAJ) equivalent: SC-74A

Drawing No. C04-120

*Controlling Parameter

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging