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TC1017 Datasheet(PDF) 12 Page - Microchip Technology

Part No. TC1017
Description  150 mA, Tiny CMOS LDO With Shutdown
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Maker  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
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TC1017 Datasheet(HTML) 12 Page - Microchip Technology

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TC1017
DS21813F-page 12
 2005-2013 Microchip Technology Inc.
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when the die temperature exceeds
approximately 160°C. The regulator remains off until
the die temperature drops to approximately 150°C.
5.2
Power Dissipation: SC-70
The TC1017 is available in the SC-70 package. The
thermal resistance for the SC-70 package is
approximately 450°C/W when the copper area used in
the PCB layout is similar to the JEDEC J51-7 high ther-
mal conductivity standard or semi-G42-88 standard.
For applications with a larger or thicker copper area,
the thermal resistance can be lowered. See AN792, “A
Method to Determine How Much Power a SOT-23 Can
Dissipate in an Application” (DS00792), for a method to
determine the thermal resistance for a particular appli-
cation.
The TC1017 power dissipation capability is dependant
upon several variables: input voltage, output voltage,
load current, ambient temperature and maximum
junction temperature. The absolute maximum steady-
state junction temperature is rated at +125°C. The
power dissipation within the device is equal to:
EQUATION 5-1:
The VIN x IGND term is typically very small when
compared to the (VIN–VOUT) x ILOAD term, simplifying
the power dissipation within the LDO to be:
EQUATION 5-2:
To determine the maximum power dissipation
capability, the following equation is used:
EQUATION 5-3:
Given the following example:
Find:
1.
Internal power dissipation:
2.
Maximum allowable ambient temperature:
3.
Maximum allowable power dissipation at
desired ambient:
In this example, the TC1017 dissipates approximately
158.5 mW and the junction temperature is raised 71°C
over the ambient. The absolute maximum power
dissipation is 155 mW when given a maximum ambient
temperature of 55°C.
Input voltage, output voltage or load current limits can
also be determined by substituting known values in the
power dissipation equations.
Figure 5-1 and Figure 5-2 depict typical maximum
power dissipation versus ambient temperature, as well
as typical maximum current versus ambient tempera-
ture, with a 1V input voltage to output voltage
differential, respectively.
FIGURE 5-1:
Power Dissipation vs.
Ambient Temperature (SC-70 package).
PD
VIN VOUT
 I
LOAD
VIN IGND
+
=
PD
VIN VOUT
 I
LOAD
=
PDMAX
TJ_MAX TA_MAX

R
JA
----------------------------------------------
=
Where:
TJ_MAX = the maximum junction
temperature allowed
TA_MAX = the maximum ambient
temperature
R
JA
= the thermal resistance from
junction to air
VIN = 3.0V to 4.1V
VOUT = 2.85V ±2.5%
ILOAD = 120 mA (output current)
TA = 55°C (max. desired ambient)
PDMAX
VIN_MAX VOUT_MIN
 I
LOAD
=
4.1V 2.85
0.975

 120mA
=
158.5mW
=
TA_MAX
TJ_MAX P
DMAX
R
JA
=
125
C 158.5mW 450C/W

=
54
C
=
125
C71C

=
PD
TJ_MAX TA
R
JA
------------------------------
=
155mW
=
125
C55C
450
C/W
-----------------------------------
=
0
50
100
150
200
250
300
350
400
-40
-15
10
35
60
85
110
Ambient Temperature (°C)


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