 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
TC1017 Datasheet(PDF) 3 Page - Microchip Technology |
|
||||||||||||||||||||||||||||||
TC1017 Datasheet(HTML) 3 Page - Microchip Technology |
|
|
3 / 26 page 
2005-2013 Microchip Technology Inc. DS21813F-page 3 TC1017 Wake-Up Time (from Shutdown mode) tWK —10 — µs VIN = 5V, IL = 60 mA, CIN = COUT =1 µF, f = 100 Hz Settling Time (from Shutdown mode) tS —32 — µs VIN = 5V, IL = 60 mA, CIN = 1 µF, COUT = 1 µF, f = 100 Hz Output Short-Circuit Current IOUTSC — 120 — mA VOUT = 0V, Average Current (Note 8) Thermal Regulation VOUT/PD —0.04 — V/W Notes 6, 7 Thermal Shutdown Die Temperature TSD — 160 — °C Thermal Shutdown Hysteresis TSD —10 — °C Output Noise eN — 800 — nV/ Hz f = 10 kHz SHDN Input High Threshold VIH 45 —— %VIN VIN = 2.7V to 6.0V SHDN Input Low Threshold VIL —— 15 %VIN VIN = 2.7V to 6.0V ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 1.0 µF, SHDN > VIH, TA = +25°C Boldface type specifications apply for junction temperatures of –40°C to +125°C. Parameter Sym. Min. Typ. Max. Units Test Conditions Note 1: The minimum V IN has to meet two conditions: VIN 2.7V and VIN (VR + 2.5%) + VDROPOUT. 2: V R is the regulator voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 3.0V. 3: 4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., T A, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.1 “Thermal Shutdown”, for more details . 8: Output current is limited to 120 mA (typ) when V OUT is less than 0.5V due to a load fault or short-circuit condition. TCVOUT VOUTMAX VOUTMIN – 10 6 VOUT T -------------------------------------------------------------------------------------- = TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +6.0V and VSS = GND. Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range TA -40 — +125 °C Extended Temperature parts Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Package Resistances3 Thermal Resistance, 5L-SOT23 JA — 255 — °C/W Thermal Resistance, 5L-SC-70 JA — 450 — °C/W |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
