S25FL032P0XMFI011 datasheet(66/69 Pages) SPANSION

Part #	S25FL032P0XMFI011

Description	32-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

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66

S25FL032P

S25FL032P_00_09 January 29, 2013

Data

She e t

19.6

FAC024 — 24-ball Ball Grid Array (6 x 8 mm) Package

PACKAGE

FAC024

JEDEC

N/A

D x E

8.00 mm x 6.00 mm NOM

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

1.20

PROFILE

A1

0.25

---

BALL HEIGHT

A2

0.70

---

0.90

BODY THICKNESS

D

8.00 BSC.

BODY SIZE

E

6.00 BSC.

BODY SIZE

D1

5.00 BSC.

MATRIX FOOTPRINT

E1

3.00 BSC.

MATRIX FOOTPRINT

MD

6

MATRIX SIZE D DIRECTION

ME

4

MATRIX SIZE E DIRECTION

N

24

BALL COUNT

Øb

0.35

0.40

0.45

BALL DIAMETER

e

1.00 BSC.

BALL PITCHL

SD/ SE

0.5/0.5

SOLDER BALL PLACEMENT

DEPOPULATED SOLDER BALLS

J

PACKAGE OUTLINE TYPE

3642 F16-038.9 \ 09.10.09

NOTES:

1.

DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2.

ALL DIMENSIONS ARE IN MILLIMETERS.

3.

BALL POSITION DESIGNATION PER JEP95, SECTION

4.3, SPP-010.

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE

CROWNS OF THE SOLDER BALLS.

7

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

8.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

9

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

10

OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.

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Manufacturer	Part #	Datasheet	Description
SPANSION	S25FL032P0XMFI011	3Mb / 69P	32-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

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S25FL032P0XMFI011 Datasheet(PDF) 66 Page - SPANSION

S25FL032P0XMFI011 Datasheet(HTML) 66 Page - SPANSION

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