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NTJD1155LT1G Datasheet(PDF) 1 Page - ON Semiconductor |
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NTJD1155LT1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 5 page © Semiconductor Components Industries, LLC, 2012 November, 2012 − Rev. 5 1 Publication Order Number: NTJD1155L/D NTJD1155L Power MOSFET 8 V, +1.3 A, High Side Load Switch with Level−Shift, P−Channel SC−88 The NTJD1155L integrates a P and N−Channel MOSFET in a single package. This device is particularly suited for portable electronic equipment where low control signals, low battery voltages and high load currents are needed. The P−Channel device is specifically designed as a load switch using ON Semiconductor state−of−the−art trench technology. The N−Channel, with an external resistor (R1), functions as a level−shift to drive the P−Channel. The N−Channel MOSFET has internal ESD protection and can be driven by logic signals as low as 1.5 V. The NTJD1155L operates on supply lines from 1.8 to 8.0 V and can drive loads up to 1.3 A with 8.0 V applied to both VIN and VON/OFF. Features • Extremely Low RDS(on) P−Channel Load Switch MOSFET • Level Shift MOSFET is ESD Protected • Low Profile, Small Footprint Package • VIN Range 1.8 to 8.0 V • ON/OFF Range 1.5 to 8.0 V • These Devices are Pb−Free and are RoHS Compliant MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Input Voltage (VDSS, P−Ch) VIN 8.0 V ON/OFF Voltage (VGS, N−Ch) VON/OFF 8.0 V Continuous Load Current (Note 1) Steady State TA = 25°C IL ±1.3 A TA = 85°C ±0.9 Power Dissipation (Note 1) Steady State TA = 25°C PD 0.40 W TA = 85°C 0.20 Pulsed Load Current tp = 10 ms ILM ±3.9 A Operating Junction and Storage Temperature TJ, TSTG −55 to 150 °C Source Current (Body Diode) IS −0.4 A Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Junction−to−Ambient – Steady State (Note 1) RqJA 320 °C/W Junction−to−Foot – Steady State (Note 1) RqJF 220 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surface−mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). 1 2,3 5 6 SIMPLIFIED SCHEMATIC SC−88 (SOT−363) CASE 419B STYLE 30 MARKING DIAGRAM TB = Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT 3 D2 1 S1 S2 4 2 D2 G1 5 D1/G2 6 4 Q2 Q1 http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 8.0 V 170 mW @ −2.5 V 130 mW @ −4.5 V RDS(on) TYP ±1.3 A ID MAX V(BR)DSS 260 mW @ −1.8 V Device Package Shipping† ORDERING INFORMATION NTJD1155LT1G SC−88 (Pb−Free) 3000/Tape & Reel 1 TB M G G 1 http://onsemi.com |
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