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NTJD1155LT1G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTJD1155LT1G
Description  Power MOSFET High Side Load Switch with Level?뭆hift, P?묬hannel SC??8
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTJD1155LT1G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2012
November, 2012 − Rev. 5
1
Publication Order Number:
NTJD1155L/D
NTJD1155L
Power MOSFET
8 V, +1.3 A, High Side Load Switch with
Level−Shift, P−Channel SC−88
The NTJD1155L integrates a P and N−Channel MOSFET in a single
package. This device is particularly suited for portable electronic
equipment where low control signals, low battery voltages and high
load currents are needed. The P−Channel device is specifically
designed as a load switch using ON Semiconductor state−of−the−art
trench technology. The N−Channel, with an external resistor (R1),
functions as a level−shift to drive the P−Channel. The N−Channel
MOSFET has internal ESD protection and can be driven by logic
signals as low as 1.5 V. The NTJD1155L operates on supply lines from
1.8 to 8.0 V and can drive loads up to 1.3 A with 8.0 V applied to both
VIN and VON/OFF.
Features
Extremely Low RDS(on) P−Channel Load Switch MOSFET
Level Shift MOSFET is ESD Protected
Low Profile, Small Footprint Package
VIN Range 1.8 to 8.0 V
ON/OFF Range 1.5 to 8.0 V
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Input Voltage (VDSS, P−Ch)
VIN
8.0
V
ON/OFF Voltage (VGS, N−Ch)
VON/OFF
8.0
V
Continuous Load Current
(Note 1)
Steady
State
TA = 25°C
IL
±1.3
A
TA = 85°C
±0.9
Power Dissipation
(Note 1)
Steady
State
TA = 25°C
PD
0.40
W
TA = 85°C
0.20
Pulsed Load Current
tp = 10 ms
ILM
±3.9
A
Operating Junction and Storage Temperature
TJ,
TSTG
−55 to
150
°C
Source Current (Body Diode)
IS
−0.4
A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Junction−to−Ambient – Steady State (Note 1)
RqJA
320
°C/W
Junction−to−Foot – Steady State (Note 1)
RqJF
220
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 inch sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
1
2,3
5
6
SIMPLIFIED SCHEMATIC
SC−88
(SOT−363)
CASE 419B
STYLE 30
MARKING
DIAGRAM
TB = Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
3
D2
1
S1
S2
4
2
D2
G1
5
D1/G2
6
4
Q2
Q1
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
8.0 V
170 mW @ −2.5 V
130 mW @ −4.5 V
RDS(on) TYP
±1.3 A
ID MAX
V(BR)DSS
260 mW @ −1.8 V
Device
Package
Shipping
ORDERING INFORMATION
NTJD1155LT1G
SC−88
(Pb−Free)
3000/Tape & Reel
1
TB M G
G
1
http://onsemi.com


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