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MT8VDDT3264AG-40BC4 Datasheet(PDF) 1 Page - Micron Technology

Part No. MT8VDDT3264AG-40BC4
Description  256MB, 512MB (x64, SR) 184-Pin DDR SDRAM UDIMM
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Manufacturer  MICRON [Micron Technology]
Direct Link  http://www.micron.com
Logo MICRON - Micron Technology

MT8VDDT3264AG-40BC4 Datasheet(HTML) 1 Page - Micron Technology

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Products and specifications discussed herein are subject to change by Micron without notice.
256MB, 512MB (x64, SR) 184-Pin DDR SDRAM UDIMM
Features
PDF: 09005aef80867ab3/Source: 09005aef80867a99
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD8C32_64x64A.fm - Rev. J 8/08 EN
1
©2003 Micron Technology, Inc. All rights reserved.
DDR SDRAM UDIMM
MT8VDDT3264A – 256MB
MT8VDDT6464A – 512MB
For component data sheets, refer to Micron’s Web site: www.micron.com
Features
• 184-pin, unbuffered dual in-line memory module
(UDIMM)
• Fast data transfer rates: PC2100, PC2700, or PC3200
• 256MB (32 Meg x 64), and 512MB (64 Meg x 64)
•VDD = VDDQ = +2.5V (-40B: VDD = VDDQ)
•VDDSPD = +2.3V to +3.6V
• 2.5V I/O (SSTL_2-compatible)
• Internal pipelined double data rate (DDR)
2n-prefetch architecture
• Bidirectional data strobe (DQS) transmitted/
received with data—that is, source-synchronous
data capture
• Differential clock inputs (CK and CK#)
• Multiple internal device banks for concurrent
operation
• Single rank
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
maximum average periodic refresh interval
• Serial presence-detect (SPD) with EEPROM
• Selectable CAS latency (CL) for maximum
compatibility
• Gold edge contacts
184-Pin UDIMM (MO-206) Figures
Figure 1:
Standard Layout
PCB height: 31.75mm (1.25in)
Figure 2:
Alternative Layout
Figure 3:
Reduced-Height Layout
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. Not recommended for new designs.
Options
Marking
• Operating temperature1
– Commercial (0°C ≤ TA ≤ +70°C)
None
– Industrial (–40°C ≤ TA ≤ +85°C)
I
•Package
– 184-pin DIMM (standard)
G
– 184-pin DIMM (Pb-free)
Y
• Memory clock, speed, CAS latency
– 5.0ns (200 MHz), 400 MT/s, CL = 3
-40B
– 6.0ns (167 MHz), 333 MT/s, CL = 2.5
-335
– 7.5ns (133 MHz), 266 MT/s, CL = 22
-262
– 7.5ns (133 MHz), 266 MT/s, CL = 22
-26A
– 7.5ns (133 MHz), 266 MT/s, CL = 2.52
-265
PCB height: 31.75mm (1.25in)
PCB height: 28.58mm (1.125in)


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