FDC653 datasheet(2/4 Pages) FAIRCHILD

Part #	FDC653

Description	N-Channel Enhancement Mode Field Effect Transistor

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Manufacturer	FAIRCHILD [Fairchild Semiconductor]

Direct Link	http://www.fairchildsemi.com

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ELECTRICAL CHARACTERISTICS (T

A = 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

OFF CHARACTERISTICS

BV

DSS

Drain-Source Breakdown Voltage

V

GS = 0 V, ID = 250 µA

30

V

∆BV

DSS/∆TJ

Breakdown Voltage Temp. Coefficient

I

D = 250 µA, Referenced to 25

o C

31

mV /

oC

I

DSS

Zero Gate Voltage Drain Current

V

DS = 24 V, VGS = 0 V

1

µA

T

J = 55

oC

10

µA

I

GSSF

Gate - Body Leakage, Forward

V

GS = 20 V, VDS = 0 V

100

nA

I

GSSR

Gate - Body Leakage, Reverse

V

GS = -20 V, VDS= 0 V

-100

nA

ON CHARACTERISTICS (Note 2)

V

GS(th)

Gate Threshold Voltage

V

DS = VGS, ID = 250 µA

1

1.7

2

V

∆V

GS(th)/∆TJ

Gate Threshold VoltageTemp.Coefficient

I

D = 250 µA, Referenced to 25

o C

-4.2

mV /

oC

R

DS(ON)

Static Drain-Source On-Resistance

V

GS = 10 V, ID = 5 A

0.027

0.035

Ω

T

J = 125

oC

0.042

0.056

V

GS = 4.5 V, ID = 4.2 A

0.046

0.055

I

D(on)

On-State Drain Current

V

GS = 10 V, VDS = 5 V

8

A

g

FS

Forward Transconductance

V

DS = 10 V, ID= 5 A

6.2

S

DYNAMIC CHARACTERISTICS

C

iss

Input Capacitance

V

DS = 15 V, VGS = 0 V,

350

pF

C

oss

Output Capacitance

f = 1.0 MHz

220

pF

C

rss

Reverse Transfer Capacitance

80

pF

SWITCHING CHARACTERISTICS (Note 2)

t

D(on)

Turn - On Delay Time

V

DD = 10 V, ID = 1 A,

7.5

15

ns

t

r

Turn - On Rise Time

V

GS = 4.5 V, RGEN = 6 Ω

12

25

ns

t

D(off)

Turn - Off Delay Time

13

25

ns

t

f

Turn - Off Fall Time

6

15

ns

Q

g

Total Gate Charge

V

DS = 15 V, ID = 5 A,

12

17

nC

Q

gs

Gate-Source Charge

V

GS = 10 V

2.1

nC

Q

gd

Gate-Drain Charge

2.6

nC

DRAIN-SOURCE DIODE CHARACTERISTICS

I

S

Continuous Source Diode Current

1.3

A

V

SD

Drain-Source Diode Forward Voltage

V

GS = 0 V, IS = 1.3 A

(Note 2)

0.75

1.2

V

T

J = 125

oC

0.6

1

Notes:

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by

design while RθCA is determined by the user's board design.

a. 78

oC/W when mounted on a minimum on a 1 in2 pad of 2oz Cu in FR-4 board.

b. 156

oC/W when mounted on a minimum pad of 2oz Cu in FR-4 board.

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

FDC653N Rev.C

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