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W631GG6KB-15 Datasheet(PDF) 4 Page - Winbond |
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W631GG6KB-15 Datasheet(HTML) 4 Page - Winbond |
4 / 158 page W631GG6KB Publication Release Date: Feb. 27, 2013 Revision A04 - 4 - 9.9 On-Die Termination (ODT) Levels and Characteristics .....................................................................112 9.9.1 ODT Levels and I-V Characteristics ...............................................................................112 9.9.2 ODT DC Electrical Characteristics .................................................................................113 9.9.3 ODT Temperature and Voltage sensitivity .....................................................................113 9.9.4 Design guide lines for RTTPU and RTTPD .......................................................................114 9.10 ODT Timing Definitions .....................................................................................................................115 9.10.1 Test Load for ODT Timings ............................................................................................115 9.10.2 ODT Timing Definitions ..................................................................................................115 9.11 Input/Output Capacitance .................................................................................................................119 9.12 Overshoot and Undershoot Specifications ........................................................................................120 9.12.1 AC Overshoot /Undershoot Specification for Address and Control Pins: .......................120 9.12.2 AC Overshoot /Undershoot Specification for Clock, Data, Strobe and Mask pins:.........120 9.13 IDD and IDDQ Specification Parameters and Test Conditions .........................................................121 9.13.1 IDD and IDDQ Measurement Conditions .......................................................................121 9.13.2 IDD Current Specifications .............................................................................................131 9.14 Clock Specification............................................................................................................................132 9.15 Speed Bins........................................................................................................................................133 9.15.1 DDR3-1333 Speed Bin and Operating Conditions .........................................................133 9.15.2 DDR3-1600 Speed Bin and Operating Conditions .........................................................134 9.15.3 DDR3-1866 Speed Bin and Operating Conditions .........................................................135 9.15.4 Speed Bin General Notes ..............................................................................................136 9.16 AC Characteristics ............................................................................................................................137 9.16.1 AC Timing and Operating Condition for -11 speed grade ..............................................137 9.16.2 AC Timing and Operating Condition for -12/12I/12A/12K/-15/15I/15A/15K speed grades 141 9.16.3 Timing Parameter Notes ................................................................................................145 9.16.4 Address / Command Setup, Hold and Derating .............................................................148 9.16.5 Data Setup, Hold and Slew Rate Derating .....................................................................155 10. PACKAGE SPECIFICATION ............................................................................................................157 11. REVISION HISTORY ........................................................................................................................158 |
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