B57891M0682000 datasheet(23/28 Pages) EPCOS | NTC thermistors for temperature measurement

23 / 28 page

Placement and orientation of SMD NTC thermistors on PCB

a) Component placement

It is recommended that the PC board

should be held by means of some

adequate supporting pins such as

shown left to prevent the SMDs from

being damaged or cracked.

b) Cracks

When placing a component near an

area which is apt to bend or a grid

groove on the PC board, it is advisable

to have both electrodes subjected to

uniform stress, or to position the

component's electrodes at right angles

to the grid groove or bending line (see

c) Component orientation).

c) Component orientation

Choose a mounting position that

minimizes the stress imposed on the

chip during flexing or bending of the

board.

Temperature measurement and compensation

B57891M

Leaded NTC thermistors, lead spacing 2.5 mm

M891

Page 23 of 28

Please read Cautions and warnings and

Important notes at the end of this document.

B57891M0682000 Datasheet(PDF) 23 Page - EPCOS